Kako se profesionalno prave stampane plocice????

Darko_zed: 
Poztupak profesionalne izrade je isti ovakav

source:
The process begins with our first step, the conditioner. The conditioner wets the hole and promotes the adhesion of the conductive polymer to surfaces difficult to cover. The conditioner applies a thin film on non-metallic surfaces. This step allows the exposed fiberglass to accept the manganese dioxide (MnO2) provided in the second step of our process. It also promotes adhesion of the MnO2 onto other materials such as Teflon and polyimide. Wetting of the hole is very important. It is critical to remove all traces of air from the hole. Vibration, ultrasonics and solution movement provided by side to side agitation or eduction are critical in the first process step. In my experience once the side wall of the hole is coated the rest of the process works. Entrapped air in the hole prevents the film from forming on the side wall of the hole.

After the conditioner step the holes are subjected to a series of rinses. This removes excess chemistry and reduces the amount of chemical drag-out of the first step chemistry into our second process step. The second process step is the initiator. This is a high temperature process step. The initiator coats the non-metallic surfaces in the hole with MnO2. The MnO2 is the conductive portion of the semi-conductive polymer.

After the initiator step the holes are again subjected to a series of rinses. The rinses between the second and third process steps is critical. Drag-out from process step two into process step three should be kept to a minimum. Step three of our process is the catalyst. The catalyst is an organic monomer that combines with the MnO2 and forms the semi-conductive polymer. Process step three is self-limiting. Once all of the MnO2 is combined with the monomer the process stops.

Following the third process step are another series of rinses to remove any excess chemistry. After the rinses an anti-tarnish (Enthone CU-56) may be applied. After the anti-tarnish is applied a final rinse is done followed by drying. Drying is a critical step for it is important to remove any excess moisture from the through holes if Envision HDI is used with a pattern plate operation. The moisture would not damage the semi-conductive polymer. Pattern plating uses a dry film photo resist to act as a plating resist. Moisture in the holes may lock the dry film in at the knee of the hole and prevent that area from plating with copper and then tin. This ultimately results in a rim void. Panel or flash plating is another story. Drying needs to be done to minimize copper oxidation. However, if panel or flash plating is done in line with Envision HDI the holes are already wet and ready for processing

Reworking of the conductive polymer requires the applied polymer to be completely stripped off. This can be done quickly and efficiently through an existing permanganate desmear process line. The solvent swell is avoided since we do not want to attack the laminate. The permanganate dissolves and removes the semi-conductive polymer when it comes into contact. After the permanganate step the panels should be processed through desmear rinse, neutralizing and final rinse operations.

Koliko sam ja provalio lik ubacuje neku pastu u izbusene rupe preko sablona i posle samo zagreje tu pastu koja se pretvori u metal, ispravite me ako gresim.
Jel nekome poznata ova pasta, ima li nekog hemicara ovde?

Drugo, gde naci foto pozitiv lak u boji?

Mora da ima neka fora da se to odradi lako i jednostavno a da rezultat bude profi.